Anterwell Technology Ltd.

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HY6264ALP-10 8 pin ic chip electronic devices and integrated circuits Integrated Circuit Chip x8 SRAM

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Anterwell Technology Ltd.
City:shenzhen
Province/State:guangdong
Country/Region:china
Contact Person:MissSharon Yang
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HY6264ALP-10 8 pin ic chip electronic devices and integrated circuits Integrated Circuit Chip x8 SRAM

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Brand Name :Anterwell
Model Number :HY6264ALP-10
Certification :new & original
Place of Origin :original factory
MOQ :10pcs
Price :Negotiate
Payment Terms :T/T, Western Union, Paypal
Supply Ability :7800pcs
Delivery Time :1 day
Packaging Details :Please contact me for details
Power Supply, Input/Output Voltage :0.5 to 7.0 V
Operating Temperature :0 to 70 °C
Storage Temperature :-65 to 125 °C
Power Dissipation :1.0 W
Data Output Current :50 mA
Lead Soldering Temperature & Time :260 °C &10sec
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HY6264A Series 8Kx8bit CMOS SRAM

DESCRIPTION

The HY6264A is a high-speed, low power and 8,192x8-bits CMOS static RAM fabricated using Hyundai's high performance twin tub CMOS process technology. This high reliability process coupled with innovative circuit design techniques, yields maximum access time of 70ns. The HY6264A has a data retention mode that guarantees data to remain valid at the minimum power supply voltage of 2.0 volt. Using the CMOS technology, supply voltage from 2.0 to 5.5 volt has little effect on supply current in the data retention mode. Reducing the supply voltage to minimize current drain is unnecessary for the HY6264A Series.

FEATURES

· Fully static operation and Tri-state outputs

· TTL compatible inputs and outputs

· Low power consumption

· Battery backup(L/LL-part)

-2.0V(min.) data retention

· Standard pin configuration

-28 pin 600 mil PDIP

-28 pin 330 mil SOP

ABSOLUTE MAXIMUM RATING (1)

Symbol Parameter Rating Unit
Vcc, VIN, VOUT Power Supply, Input/Output Voltage -0.5 to 7.0 V
TA Operating Temperature 0 to 70 °C
TSTG Storage Temperature -65 to 125 °C
PD Power Dissipation 1.0 W
IOUT Data Output Current 50 mA
TSOLDER Lead Soldering Temperature & Time 260 ·10 °C·sec

Note 1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is stress rating only and the functional operation of the device under these or any other conditions above those indicated in the operation of this specification is not implied. Exposure to the absolute maximum rating conditions for an extended period may affect reliability.

ORDERING INFORMATION

PART NO. SPEED POWER PACKAGE
HY6264AP 70/85/100 PDIP
HY6264ALP 70/85/100 L-part PDIP
HY6264ALLP 70/85/100 LL-part PDIP
HY6264AJ 70/85/100 SOP
HY6264ALJ 70/85/100 L-part SOP
HY6264ALLJ 70/85/100 LL-part SOP

PIN CONNECTION BLOCK DIAGRAM

HY6264ALP-10 8 pin ic chip electronic devices and integrated circuits Integrated Circuit Chip x8 SRAM

PACKAGE INFORMATION

28pin 600mil Dual In-Line Package(P)

HY6264ALP-10 8 pin ic chip electronic devices and integrated circuits Integrated Circuit Chip x8 SRAM

28pin 330mil Small Outline Package(J)

HY6264ALP-10 8 pin ic chip electronic devices and integrated circuits Integrated Circuit Chip x8 SRAM

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