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CD54/74HC123, CD54/74HCT123, CD74HC423, CD74HCT423
High-Speed CMOS Logic Dual Retriggerable Monostable Multivibrators with Resets
Features
• Overriding Reset Terminates Output Pulse
• Triggering From the Leading or Trailing Edge
• Q and Q Buffered Outputs
• Separate Resets
• Wide Range of Output-Pulse Widths
• Schmitt Trigger on Both A and B Inputs
• Fanout (Over Temperature Range)
- Standard Outputs . . . . . . . . . . . . . . . 10 LSTTL Loads
- Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads
• Wide Operating Temperature Range . . . -55℃ to 125℃
• Balanced Propagation Delay and Transition Times
• Significant Power Reduction Compared to LSTTL Logic ICs
• HC Types
- 2V to 6V Operation
- High Noise Immunity: NIL = 30%, NIH = 30%of VCC at VCC = 5V
• HCT Types
- 4.5V to 5.5V Operation
- Direct LSTTL Input Logic Compatibility, VIL= 0.8V (Max), VIH = 2V (Min)
- CMOS Input Compatibility, Il ≤ 1µA at VOL, VOH
Description
The ’HC123, ’HCT123, CD74HC423 and CD74HCT423 are dual monostable multivibrators with resets. They are all retriggerable and differ only in that the 123 types can be triggered by a negative to positive reset pulse; whereas the 423 types do not have this feature. An external resistor (RX) and an external capacitor (CX) control the timing and the accuracy for the circuit. Adjustment of Rx and CX provides a wide range of output pulse widths from the Q and Q terminals. Pulse triggering on the A and B inputs occur at a particular voltage level and is not related to the rise and fall times of the trigger pulses
Once triggered, the output pulse width may be extended by retriggering inputs A and B. The output pulse can be terminated by a LOW level on the Reset (R) pin. Trailing edge triggering (A) and leading edge triggering (B) inputs are provided for triggering from either edge of the input pulse. If either Mono is not used each input on the unused device (A, B, and R) must be terminated high or low.
The minimum value of external resistance, Rx is typically 5kΩ. The minimum value external capacitance, CX, is 0pF. The calculation for the pulse width is tW = 0.45 RXCX at VCC = 5V.
Absolute Maximum Ratings
DC Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V
DC Input Diode Current, IIK
For VI < -0.5V or VI > VCC + 0.5V. . . . . . . . . . . . . . . . . . . . . .±20mA
DC Output Diode Current, IOK
For VO < -0.5V or VO > VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±20mA
DC Output Source or Sink Current per Output Pin, IO
For VO > -0.5V or VO < VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±25mA
DC VCC or Ground Current, ICC or IGND . . . . . . . . . . . . . . . . . .±50mA
Operating Conditions
Temperature Range (TA) . . . . . . . . . . . . . . . . . . . . . -55℃ to 125℃
Supply Voltage Range, VCC
HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V
HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V
DC Input or Output Voltage, VI , VO . . . . . . . . . . . . . . . . . 0V to VCC
Input Rise and Fall Time
2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max)
4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max)
6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max)
Thermal Information
Package Thermal Impedance, θJA (see Note 1):
E (PDIP) Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .67℃/W
M (SOIC) Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .73℃/W
NS (SOP) Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64℃/W
PW (TSSOP) Package . . . . . . . . . . . . . . . . . . . . . . . . . 108℃/W
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 150℃
Maximum Storage Temperature Range . . . . . . . . . . -65℃ to 150℃
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300℃
(SOIC - Lead Tips Only)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE: 1. The package thermal impedance is calculated in accordance with JESD 51-7.
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